JPH0521332B2 - - Google Patents

Info

Publication number
JPH0521332B2
JPH0521332B2 JP60029458A JP2945885A JPH0521332B2 JP H0521332 B2 JPH0521332 B2 JP H0521332B2 JP 60029458 A JP60029458 A JP 60029458A JP 2945885 A JP2945885 A JP 2945885A JP H0521332 B2 JPH0521332 B2 JP H0521332B2
Authority
JP
Japan
Prior art keywords
mask
cooling plate
temperature
exposure apparatus
exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60029458A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61189637A (ja
Inventor
Masato Muraki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP60029458A priority Critical patent/JPS61189637A/ja
Publication of JPS61189637A publication Critical patent/JPS61189637A/ja
Publication of JPH0521332B2 publication Critical patent/JPH0521332B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP60029458A 1985-02-19 1985-02-19 露光装置 Granted JPS61189637A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60029458A JPS61189637A (ja) 1985-02-19 1985-02-19 露光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60029458A JPS61189637A (ja) 1985-02-19 1985-02-19 露光装置

Publications (2)

Publication Number Publication Date
JPS61189637A JPS61189637A (ja) 1986-08-23
JPH0521332B2 true JPH0521332B2 (en]) 1993-03-24

Family

ID=12276657

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60029458A Granted JPS61189637A (ja) 1985-02-19 1985-02-19 露光装置

Country Status (1)

Country Link
JP (1) JPS61189637A (en])

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7102763B2 (en) 2000-07-08 2006-09-05 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7399713B2 (en) 1998-03-13 2008-07-15 Semitool, Inc. Selective treatment of microelectric workpiece surfaces

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2673517B2 (ja) * 1987-06-15 1997-11-05 キヤノン株式会社 露光装置
JP4088728B2 (ja) * 1998-07-09 2008-05-21 株式会社ニコン 平面モータ装置、駆動装置及び露光装置
JP4745556B2 (ja) 2001-08-20 2011-08-10 キヤノン株式会社 位置決め装置、露光装置、及びデバイス製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7399713B2 (en) 1998-03-13 2008-07-15 Semitool, Inc. Selective treatment of microelectric workpiece surfaces
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7102763B2 (en) 2000-07-08 2006-09-05 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology

Also Published As

Publication number Publication date
JPS61189637A (ja) 1986-08-23

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term